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The 14th International Conference on Mobile Computing and Ubiquitous Networking (ICMU2023)

Kyoto, Japan + Online (Hybrid)
November 29th - December 1st, 2023


Scope and Aim

ICMU2023 – The Fourteenth International Conference on Mobile Computing and Ubiquitous Networking – focuses on the active area of research and development in mobile social systems, communications, applications, algorithms, and infrastructure as well as ubiquitous services and computing. The special focus of ICMU includes advancing technologies for next-generation distributed and ubiquitous computing and services where humans, cloud and edge infrastructure, networked sensors, connected devices, and environments are involved. Examples of such technologies are IoT, smart cities, sensor-based services and societies, energy-efficient mobile systems, AI applications in social services, digital twins, cloud and edge computing for mobile computing, and crowd sourcing and sensing. Not only these issues but also fundamental algorithms and theories for mobile system privacy, security, reliability, trust, and robustness are also topics of interest. Authors are invited to submit their research contributions addressing the topics in mobile and pervasive computing and ubiquitous networking.

The topics include, but are not limited to:


kokoka Kyoto International Community House, 2-1 Torii-cho, Awataguchi, Sakyo-ku, Kyoto, Japan + Online (Hybrid)

Important Dates

Paper Submission Due (1st round) June 26th, 2023 AoE August 10th, 2023 AoE (Extended)
Acceptance Notification (1st round) July 24th, 2023 AoE September 7th, 2023 AoE (Extended)
Submission Due (2nd round) September 14th, 2023 AoE  
Acceptance Notification (2nd round) September 28th, 2023 AoE  
Camera-Ready Due August 17th, 2023 AoE October 19th, 2023 AoE (Extended)

In principle, we use the same acceptance criteria for both review rounds. Thus, we may accept some 1st-round submissions in 2nd-round notification.

Journal Recommendation

Selected papers will be recommended for a special issue of the Sensors & Materials Journal.

Journal’s Website:

Submission Guidelines

Submitted manuscripts must be formatted in standard IEEE camera-ready format (double-column, 10-pt font) and must be submitted through EDAS as PDF files (formatted for 8.5x11-inch or A4-size paper). The manuscripts should be no longer than 6 pages.

Please follow the instructions given on the submission instruction page.

Student Grants

ICMU 2023 offers Student Grants to students who co-authored an accepted paper/poster/demo in the conference. Each grant is offered as a free registration. Please see Call for Student Grant page for details.

Organizing Committee

General Co-Chairs

Teruo Higashino (Kyoto Tachibana University, Japan)

Insup Lee (University of Pennsylvania, PA, USA)

TPC Co-Chairs

Shigemi Ishida (Future University Hakodate, Japan)

Song Min Kim (KAIST, Korea)

Takuya Yoshihiro (Wakayama University, Japan)

Financial Co-Chairs

Hidekazu Suzuki (Meijo University, Japan)

Kazuya Murao (Ritsumeikan University, Japan)

Manato Fujimoto (Osaka Metropolitan University, Japan)

Poster and Demo Co-Chairs

Tsubasa Yumura (Hokkaido Information University, Japan)

Yu Nakayama (Tokyo University of Agriculture and Technology, Japan)

Publicity Co-Chairs

Takuro Yonezawa (Nagoya University, Japan)

Masahide Nakamura (Kobe University, Japan)

Francois Portet (Université Grenoble Alpes, France)

Local Arrangement Co-Chairs

Hiroki Yoshikawa (Kyoto Tachibana University, Japan)

Publication Co-Chairs

Ayumu Kubota (KDDI Research Inc., Japan)

Takeshi Yoshimura (NTT DOCOMO, Japan)

Registration Co-Chairs

Akihito Taya (The University of Tokyo, Japan)

Award Chair

Hiroshi Inamura (Future University Hakodate, Japan)

Philippe Lalanda (Université Grenoble Alpes, France)

Web Chair

Akihiro Fujimoto (Wakayama University, Japan)


Endorsed and organized by

Information Processing Society Japan (IPSJ) SIG-MBL

Technically co-sponsored by

IEEE computer society

Financially supported by

National Institute of Information and Communications Technology (NICT)

Supported by



E-mail: icmu2023-contact[@]